Comments on Profile Post by ultrabike

I think Spock "got caught up in an unavoidable technology process-node end of life" in Star Trek III...?

Most of the new offerings do not have DIP-8 packaging. In fact, their new apparent flagship headphone driver is VSOC! WTF! It's apparent they are pushing the DIY market aside. We are down to AD, LT, and NJM.

I guess it depends how far you want to go with DIY. Non-DIP package types are still DIY-able. I don't know what VSOC is since it's not a JEDEC standard package name, but what makes it difficult to DIY?

I misspelled it. It's VSON. It's 3.0mm x 3.0mm. The particular part I was looking at is the OPA1622. It is a 10 port VSON with a big heat pad:

http://www.ti.com/lit/ds/symlink/opa1622.pdf

Here is some discussion about it:

http://www.diyaudio.com/forums/vendors-bazaar/283672-new-audio-op-amp-opa1622.html

Seems like ultimate CMOY material.

It even incorporates an enable pin which saves up a bit in protection relays.

Heh, yeah that'd be sweet in CMOY.

LOL! This guy went for it:

http://www.diyaudio.com/forums/headphone-systems/290801-universal-buffer-headamp-based-opa1622.html

Though I think he is using it w/o gain.

Looks pretty interesting. The target IMO seems to be highly integrated solutions, with high end DAC/ADCs and stuff like that. But they are killing the DIP-8 offerings.

Yeah, I don't think $10 billion semi corps have a DIY "market". :-) But you could still solder these parts with paste and heat.

Oh look, one guy in that thread soldered it upside down with fly leads hanging off the pads. LOL.

LOL! Yeah, the "DIY market" is really not a market per say relatively speaking. It is what it is. Times change.

And yes, you can use solder paste and heat. But that part will proly be a bit difficult for non-rework-pros even then.

LOL! There you go. Application:

https://www.amazon.com/Balanced-Output-Headphone-Amplifier-Titanium/dp/B01H18RDBM

(and the Fiio E17K)

They seem to be targeting phones.